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Corrosion and Failure Analysis Services for the Semiconductor Manufacturing and Chemical Process Industries

Our Services

Corrosion Testing

A broad range of testing from simple immersion to advanced AC and DC electrochemical techniques.

Surface Analysis, Auger and XPS

Our broad set of surface analysis includes electron photon spectroscopy (XPS) and auger analysis.

Scanning Electron Microscopy

Enables routine failure analysis work and advanced including line scans, point analysis plus element mapping. 

FTIR 

Our non destructive examination uses an infrared microscope to evaluate absorption bands in a molecular structure.

Metallography

Examination of mounted, ground, and polished metallographic sections enables a broad set of quality control and failure analysis.

Welding and Braze Evaluation

We provide failure analysis and first article testing across arc, MIG, TIG, electron beam, laser, and metal arc welding.

Profilometry

Uses a contact measurement technique with a diamond-tipped stylus to measure surface roughness.

Hardness Testing

Hardness testing of materials, particularly metals, alloys, and ceramics allows direct measure of mechanical properties.

Mechanical Testing

Our mechanical testing services support tensile, compression, and torsion testing using low strength “load-cells” up to 500 lb.

Dye Penetrant Test

Leverages penetrating dye to find cracks in metal surfaces, welds, brazes, ceramics and polymers.

Industries Served

Failure Analysis

We follow well established procedures to carry out root cause analysis of failures. The techniques used are shown below: 
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